LeapWave Technologies

UNLIMITED BANDWIDTH.
UNLEASHED.

A paradigm shift in high-bandwidth interconnections — from 50 GHz to 500 GHz — in a single connector interface.

 
LEAPWAVE PORT — CONTINUOUS SPECTRUM < 0.15 dB/cm LOSS
50 GHz 500+ GHz
[ One continuous, low-loss interface spanning millimeter-wave, sub-millimeter-wave and THz frequencies. ]
THE BOTTLENECK
  50 GHz
  110 GHz
  170 GHz
HARD LIMIT 220 GHz
HARD LIMIT 500 GHz
[THE INDUSTRY CHALLENGE]

Traditional interconnects hit a wall well before the frequencies your systems need today.

Coaxial and rectangular waveguide standards were never built for the sub-millimeter and THz domain. Past a few hundred GHz, insertion loss climbs, integration gets brittle, and photonics and RF stop speaking the same language.

[THE LEAPWAVE SOLUTION]

Introducing Dielectric Rod Waveguide (DRW) Technology

Connecting the worlds of photonics and RF with a single interface — one continuous, low-loss path from 50 GHz to beyond 500 GHz.

 
001.

Ultra-Low Loss

Insertion and propagation losses kept under control across the full band.

< 1 dB/cm
002.

Ultra-Wide Band

Seamless, continuous operation across the entire spectrum in one interface.

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003.

Versatile Integration

Drop-in compatible with today’s standards via our low-loss coaxial transitions.

Coax & WG ready

004.

Hybrid Assembly

Bringing the best of RF and photonics together in one physical layer.

RF + Photonics

[Products]

One platform. Four ways to move beyond the mmWave limit.

( 01 )
DRW500
Ultra-low-loss signal propagation
50–500+ GHz
( 02 )
TX500
Ultra-wideband signal generation
50–500 GHz
( 03 )
RX500
Ultra-wideband amplitude reception
50–500 GHz
( 04 )
CT/110
Coaxial-to-DRW transition
Standard compatibility
[WHERE IT'S USED]

Built for the systems pushing past the mmWave ceiling.

Instrumentation

Wafer Level Testing (WLT) for high-speed semiconductors.

Communications

Next-generation UWB interconnects for high-throughput links.

 

Non-Destructive Analysis

Contactless measurement across industrial and research settings.

 

Semiconductor Packaging

Hybrid assembly and integration for photonics + RF packaging lines.

 
[Services]

Engineering Services

01. IP Licensing
TECHNOLOGY LICENSING

Explain how companies can license your DRW interface technology for their own manufacturing or packaging lines.

CUSTOM ENGINEERING

Offer custom design services for specific millimeter and sub-millimeter wave challenges.

TESTING & VALIDATION

Offer access to your testing capabilities for external partners.

[LATEST]

News & Funded Projects

Featured Project
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Deep-tech engineering

for the next generation

of high-frequency systems.

LeapWave Technologies is a deep-tech company developing the physical interface between RF electronics and photonics. Our mission is to make ultra-wideband interconnections simpler, lower-loss and ready for real-world integration.

50–500+ GHz
One continuous interface